Business Wire

Avishtech’s Latest Generation of Its Gauss Stack PCB Stack-Up Design and Simulation Software Features Skew Prediction Capability

SAN JOSE, Calif.--(BUSINESS WIRE)--Avishtech (www.avishtech.com), the leading provider of innovative EDA stack-up and 2D field solver solutions, today announced significant enhancements to its Gauss ...
PlasticsToday

Cadence Launches AI Super Agent for PCB, Packaging Design

Cadence launches AuraStack AI Super Agent on Allegro AI Studio platform to automate PCB and advanced packaging design ...

Cadence Expands AI Agents With AuraStack For PCB And Advanced Chip Packaging

Cadence believes the next level of AI-assisted engineering resides at the system level, and to that end, the company just ...
Design And Reuse

Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging

Running on Allegro AI Studio, the AuraStack AI Super Agent delivers up to 2X faster time to market, 15X higher productivity and multiphysics-driven quality across the industry's only silicon-to-system ...

Cadence's AuraStack agent melds AI with HPC to speed PCB, advanced packaging design

How AI will change the way scientific computing is done remains an open question. One relies on ultra-precise ...
NewsBytes

Cadence launches AuraStack AI for natural language PCB packaging design

Cadence Design Systems introduced AuraStack, an AI-powered agent that accelerates circuit board and chip packaging design, ...
Business Wire

Avishtech Introduces Latest Generation of Its Revolutionary Gauss Stack PCB Stack-Up Tool

SAN JOSE, Calif.--(BUSINESS WIRE)--Avishtech (www.avishtech.com), the leading provider of innovative EDA stack-up and 2D field solver solutions, today announced the availability of the latest version ...