AMSTERDAM--(BUSINESS WIRE)--Telink and Nowi reinforce their existing partnership by launching an Energy Autonomous Wireless Connectivity Module. This new product offering enables additional energy ...
NUREMBURG, Germany--(BUSINESS WIRE)--Quectel Wireless Solutions, a global IoT solutions provider, and STACKFORCE GmbH today announced at Embedded World in Nuremburg that wireless M-Bus (wM-Bus) ...
The Radio Internet-Protocol Communications Module (RIC-M) developed by the Department of Homeland Security’s (DHS) Science and Technology Directorate (S&T) has been licensed to two commercial partners ...
Type 2FP Wi-Fi 6 + BLE 5.4 multi-radio module from Murata Electronics. The compact, highly integrated Type 2FP module is based on the NXP RW610 wireless MCU. The built-in, high-performance MCU ...
The low-power module aims at multiprotocol applications. For example, IoT devices, heating, ventilation, air conditioning systems, automotive and telematics applications, and consumer electronics.
System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results