As artificial intelligence moves from model training into broader commercial deployment, the underlying data center architecture is changing rapidly. Higher computing density, faster interconnect ...

Australian chip manufacturing startup Syenta Inc. today announced that it has raised $26 million in funding to expand its ...

SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX) (TAIEX: 3711), today announced that it has extended its ...

Keysight Expands 1.6T Interconnect Validation Technology to Include Passive Copper and Low Power Optics Enhanced testing improves reliability and reduces risk when deploying the most demanding ...

POET Technologies Inc. shares surged more than 30% in midday trading Friday, climbing to around $15.33 as investors piled ...

Highlights 2nm ecosystem readiness, 3DIC integration, and advanced packaging leadershipSanta Clara, California, April 22, ...

The market for Data Center Interconnect is expanding significantly due to the shift towards cloud computing and AI ...

Eight of the tech industry’s largest players are teaming up to launch the UALink Promoter Group, a new artificial intelligence hardware initiative detailed today. The project focuses on developing an ...

Licensing agreement combines advanced optical innovations from 3M with US Conec's expertise in high-density connectivity solutions for next-generation networks 3M Expanded Beam Optical Interconnect is ...

Anew interconnect technology, called Solderball Pin, from interconnect manufacturer Autosplice (San Diego, CA), enables automation of individually placed surface-mount pins on pc boards. Unlike ...

Enhanced testing improves reliability and reduces risk when deploying the most demanding critical-path interconnects in AI and high‑performance computing networks SANTA ROSA, Calif.--(BUSINESS ...