Intel Corporation and Arizona-based 3D Glass Solutions (3DGS) are exploring a $3.3-billion investment in Odisha to set up India’s first advanced semiconductor glass core packaging substrate ...
ALBUQUERQUE, N.M.--(BUSINESS WIRE)--3D Glass Solutions Inc. (3DGS), a leading innovator of glass-based three-dimensional passive radio frequency (RF) devices, today announced it has secured $20 ...
Odisha government has signed a Memorandum of Understanding (MoU) with Intel and 3D Glass Solutions (3DGS) to establish an Advanced Packaging Glass Core Substrate Manufacturing Facility in the state.
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Intel and 3DGS announce plans for $3.3 billion semiconductor substrate manufacturing facility
Intel plans to build a semiconductor substrate manufacturing facility in India. The company is partnering with 3D Glass Solutions, Inc. (3DGS) to construct a facility in the eastern state of Odisha.
DENVER--(BUSINESS WIRE)--INTERNATIONAL MICROWAVE SYMPOSIUM ––3D Glass Solutions (3DGS), an innovative pure-play glass foundry, today announces its eSIW PDK is now available. With built-in design rule ...
The agreement is aimed at strengthening India's semiconductor ecosystem as the country looks to expand domestic chip manufacturing capabilities and build a complete electronics supply chain. Substrate ...
Intel, 3D Glass Solutions and the Government of Odisha sign MoU for a 3.3 billion dollar substrate manufacturing facility in ...
Odisha is set to become a major center for advanced technology and electronics manufacturing. The foundation for a semiconductor plant has been laid, marking a historic day for the state. This ...
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NEW DELHI, May 29 : U.S. chipmaker Intel and 3DGS Inc. USA will invest about $3.3 billion to set up a substrate manufacturing plant in the eastern Indian state of Odisha, the Indian government said on ...
Chief Minister Mohan Charan Majhi, Union minister for Electronics and IT Ashwini Vaishnaw, Intel Corporation CEO Lip-Bu Tan and other officials witnessed the signing of the MoU. BHUBANESWAR: In a big ...
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